Industry Focus

Chip Design & Engineering

Specialized ASIC, FPGA, and silicon verification solutions.

We provide end-to-end semiconductor engineering services, from architecture definition to physical design and post-silicon validation. Our team specializes in high-performance computing, AI accelerators, and low-power IoT controllers.

Core Capabilities

Chip Design & Engineering

Custom ASIC design, FPGA development, and semiconductor solutions for specialized computing requirements.

AI & Machine Learning

Intelligent systems, neural networks, and ML-optimized hardware for next-generation applications.

Performance Optimization

System tuning, algorithm optimization, and hardware acceleration for maximum performance.

From Design to Silicon

Understanding the journey of your custom chip production

Step 1

The "Digital Blueprint"

The GDSII File

Your team finishes the design in software (using tools like OpenLane). The final output is a massive binary file called GDSII (Graphic Data System II).

Analogy: Think of this as the "PDF" of your chip. It contains the exact geometric shapes of every transistor and wire layer (sometimes 50+ layers deep).

Step 2

The "Point of No Return"

Sign-off

Before sending the GDSII, you run "DRC" (Design Rule Checks) and "LVS" (Layout vs. Schematic).

Why

If you violate a rule (e.g., two wires are 1 nanometer too close), the factory cannot physically print the chip.

Risk

Once you tape-out, you cannot "patch" the hardware. A mistake here costs months and thousands of dollars (a "respin").

Step 3

The "Stencils"

Mask Generation

You send the GDSII file to the foundry (e.g., SkyWater or TSMC). They don't print the chip directly from the file. Instead, they use the file to create Photomasks—glass plates with chrome patterns.

Process: Light is shone through these masks onto the silicon wafer to "print" your design, layer by layer.

Step 4

(MPW)

The Shuttle Run

For a small company, you likely won't buy a whole wafer. You join a Multi-Project Wafer (MPW) shuttle.

How it works

Your design is placed on the mask alongside designs from 20 other companies. You split the cost of the masks (which are the most expensive part).

Timeline

It usually takes 3–6 months from tape-out to receiving your physical chips in the mail.